ELECTRONIC ENCAPSULATION

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  • Potting electronics

Electronic encapsulation is the process of covering a printed circuit board assembly or filling an electromechanical assembly with a protective material.

Encapsulation with protective material helps to improve the reliability and performance of complex or extremely delicate electronic components against the most demanding environments (moisture, dust, extreme temperature…)

Many manufacturers want in this way to encapsulate, stamp and isolate sensitive electrical and electronic components from damage.